본문
| EG4090u Auto Probe Station | |
| 적용분야 | ~200mm |
|---|---|
| 제조사 | ElectroGlas |
| Wafer Size Capacity | 100mm, 125mm, 150mm,200mm (4", 5", 6",8") | |
| Overall Accuracy | Within 4㎛ | |
| X/Y Positioning |
Travel | X : 503mm / Y : 239mm) |
| Speed | Maximum : 9 inch/sec(254 mm/sec) | |
| Acceleration | Maximum : 1.1G / X axis, 0.53G Y axis | |
| Resolution | 0.01 mil (0.25µm) | |
| Repeatability | 0.01 mil (0.25µm) | |
| Z-Stage | Rec. Load | 25 lbs(11.3 kg) |
| Resolution Z | 0.25 mil/step | |
| Speed | 390 µsec/step | |
| Probing Range | 230 mil(5.8mm) | |
| Travel-Full | 400 mil(10.2mm) | |
| Repeatability Z | 0.125 mil(3.2㎛) | |
| ΘTravel | ±5 ° | |
| Θ Resolution | .000917 °/step | |
| Chuck Tops | Hot Chuck : ambient to 130 °C probing, Nikel plated | |
| Automation | PTPA - Probe to Pad Alignment | |
| PTPO - Probe to Pad Optimization | ||
| OCR - Optical Character Recognition | ||
| PMI - Probe Mark Inspection | ||
| IDI - Ink Dot Inspection | ||
| STAA - Self Teach Auto Align | ||
| WSSC - Wafer Stepping and Scaling Calibration | ||
| APCC - Automatic Probe Cleaning and Continuity Pad | ||
| Networking and Tester Communications |
Standard Interfaces | |
| Hardware : RS232C, TTL(Parallel I/O), GPIB(IEEE-488) | ||
| Protocols : EG Enhanced(recommended), SECS I/I, RDP | ||
| Dimensions | Footprint - 45.3" (115 cm) W x 35.2" (89.4 cm) D x 34.2" (88 cm) H | |
| Weight - 1027 lbs (462 kgs) | ||
| Facility Requirements | Electrical : AC115/230V, 50/60 Hz, 6A/3A | |
| Air : 85 psi @ 2.3 SCFM | ||
| Vacuum : 22 in Hg @ 3.0 SCFM nom. | ||
